With AI chip demand surging, the global OSAT industry is seeing a new wave of pr...
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新加坡7月制造业PMI创八年新高,AI半导体超级周期点燃SGX科技板块
AI Concept Stocks Live新加坡采购与物流管理学院(SIPMM)8月3日发布数据显示,2026年7月新加坡制造业PMI升至51.4、电子业PMI升至52.4,双双创下2018年以来最高水...
Samsung Electronics has announced a major acceleration in the R&D and mass produ...
Singapore mainboard AI concept stock UMS Holdings reported strong quarterly earn...
Samsung 3nm GAA Yield Bottleneck Hurdles Mass Production; AI Chip Orders May Shift to TSMC
AI Concept Stocks LiveSamsung Electronics' 3nm GAA process mass production yield continues to fall sho...
TSMC advanced packaging capacity soars, AI chip demand creates new investment opportunities
AI Concept Stocks LiveTSMC announced CoWoS capacity doubling YoY in H2 2026, spurring orders for ASE, ...
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Price-Hike Wave Spreads to Singapore: STATS ChipPAC to Raise Prices Broadly in H2, AI Chip Supply-Demand Reshapes SGX Semiconductor Chain
With AI chip demand surging, the global OSAT industry is seeing a new wave of price hikes. STATS ChipPAC, a Singapore-based packaging and testing lead...
新加坡7月制造业PMI创八年新高,AI半导体超级周期点燃SGX科技板块
新加坡采购与物流管理学院(SIPMM)8月3日发布数据显示,2026年7月新加坡制造业PMI升至51.4、电子业PMI升...
HBM Market Shifts: Samsung Fast-Tracks 6th-Gen HBM4, Reshaping Asia's Memory Chip Supply Chain
Samsung Electronics has announced a major acceleration in th...
UMS Holdings Quarterly Results Beat Expectations, AI Chip Equipment Demand Ignites Singapore Semiconductor Stocks
Singapore mainboard AI concept stock UMS Holdings reported s...
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台积电CoWoS外包扩围:英伟达订单挤爆封装产线,AI芯片后道设备迎投资潮
英伟达GPU订单将台积电先进封装产线挤至极限,台积电据报决定将CoWoS核心工序CoW大规模外包给日月光等封测大厂,AI封装缺口据称达20%。这一策略性转变不仅有望缓解AI芯片供应瓶颈,更将撬动后道工序设备投资浪潮,重塑全球封测格局。AEM、UMS等新加坡半导体产业链标的或迎来增量订单与重估机会,本...
新加坡12英寸晶圆厂量产倒计时:世界先进良率99%超前达标,AI需求点燃SGX半导体新周期
世界先进新加坡合资12英寸厂VSMC完成制程导入,6月初首批40纳米试产芯片良率突破99%,量产锁定2027年一季度且进...
Philadelphia Semiconductor Index drops pre-market; AI chip earnings diverge; Singapore semiconductor sector under pressure
On August 5, the Philadelphia Semiconductor Index fell 2.8% ...
Singapore launches AI National Strategy 2.0, SGX mainboard AI concept stocks enter long-term allocation window
On July 31, 2026, the Singapore government released AI Natio...
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恩倍科登陆SGX主板:首家无晶圆厂AI芯片股诞生,边缘AI成新加坡投资新风口
超低功耗芯片设计公司恩倍科(Ambiq Micro)7月30日在新加坡交易所主板完成第二上市,成为首家在新加坡挂牌的无晶圆厂半导体公司。本文梳理其上市细节、边缘AI产品布局与新加坡扩张计划,结合SGX半导体产业链扩容与全球边缘AI芯片市场趋势,为跟踪持仓芯片标的的投资者提供一手的行业解读与观察视角。...
TSMC's 3nm Process Fully Booked Through 2027, AI Chip Orders Lock in Singapore Semiconductor Supply Chain
TSMC announced its 3nm process capacity is fully loaded thro...
AI芯片测试需求爆发,新加坡设备商AEM二季度净利翻倍
新加坡主板上市公司AEM Holdings发布2026年第二季度财报,营收与净利润双双创历史新高,AI芯片测试需求成为核...
Surge in AI Chip Packaging Demand Brings New Opportunities for Singapore's Semiconductor Supply Chain
Global AI chip packaging market grew 45% YoY in Q2 2026, wit...
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联电新加坡厂量产硅光子晶圆:AI光互连新赛道落地,SGX半导体链再添催化
联电新加坡12英寸晶圆厂交付首批量产硅光子晶圆,携手新加坡SILITH从开发到量产仅用18个月,1.6T光互连平台获头部云客户认证,AI相关收入三年剑指10亿美元。Q2净利创纪录大增374%,资本开支上修至20亿美元并加码新加坡扩产。从CPO放量到SGX科技股吸金5.8亿新元,一文看懂AI光互连新赛...
Samsung 3nm GAA Yield Hits 70%, AI Chip Order Reflow Expected to Boost SGX Semiconductor Sector
Samsung Electronics announced its 3nm GAA process yield has ...
UMS Holdings Q2 earnings beat expectations, surging AI chip packaging demand drives record performance
Singapore semiconductor equipment supplier UMS Holdings repo...
SMIC Beijing 12-inch Fab Starts Production Early, Domestic Wafer Capacity Accelerates
SMIC announced the early mass production of its Beijing 12-i...